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S77

Nebagamon S77

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Nebagamon S77

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Issue Details

Issue Number: S77

Description: Conclave 2019; Circuit Board design

Year Issued: 2019
Quantity: 100

Material: Embroidery
Backing Type: Plastic Back - Security Backing
Issue Shape: Flap - Generic
Border Type: R
Border Color: GLD
Background Color: GRN
Lettering Color: GLD
FDL/BSA Color: YEL

Manufacturer: Joycrest
PatchScan URL: Unknown
Color Count (PS): 9
Coverage (PS): 100
Size in mm: Unknown

Annotations: WWW
Conclave
FDL

Designed by: No designer listed

History: No history entry for this issue

Sets

This issue is not part of any sets

Revision History

There have been 3 revisions. Last change was update on 21 Dec 2023 by Unknown

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This issue exists in the following catalogs:

PatchVault

Nebagamon (312B) S77